Release of Technology for Optimizing the Antistatic Performance of PE Protective Film

To address the issue of electrostatic charge‑induced dust adhesion and interference with electronic device operation in applications such as the electronics industry, a new antistatic optimization technology has been introduced. This technology incorporates a specialized antistatic agent during the PE protective film manufacturing process and employs an advanced blending technique to ensure uniform distribution of the agent throughout the film, thereby establishing a stable conductive network. Testing demonstrates that PE protective films produced using this technology exhibit a significant reduction in surface resistivity, with static decay times shortened to one‑tenth of their original values. This effectively mitigates electrostatic hazards and enhances the stability of electronic devices during manufacturing, storage, and other stages.

Time:2025-08-19

To address the issue of electrostatic charging in PE protective films—commonly encountered in electronics and other fields, which can attract dust and interfere with electronic device operation—a new antistatic optimization technology has been introduced. This technology incorporates a specialized antistatic agent during the PE film‑manufacturing process and employs an advanced blending technique to ensure uniform distribution of the agent throughout the film, thereby establishing a stable conductive network. Testing demonstrates that PE protective films produced using this method exhibit a significant reduction in surface resistivity, with static‑dissipation times shortened to one‑tenth of their original values. As a result, the risk of electrostatic damage is effectively mitigated, enhancing the stability of electronic devices during manufacturing, storage, and other stages.

Keywords: Release of Technology for Optimizing the Antistatic Performance of PE Protective Film

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